Thermal silicon gap pad is a high-molecular polymer thermal conductive material designed for low pressure applications with high thermal conductivity. Fiberglass can be added to make the material easy to process and assemble. The material can be customized with one-side natural viscosity, both-sides natural viscosity or no viscosity, and it can fill the gap between the PCB and the radiator/metal chassis . Even on the very rough surface, it can provide excellent moist thermal interface, greatly reducing the thermal resistance of the interface. It is applied in graphics integrated circuits, power converters, memory modules, automotive engine/drive control. It is widely used......
Product introduction：
◆ Thermal conductivity: 0.8-8 w/m-k, excellent thermal conductivity, some special gap pad can reach 16w/m-k
◆ Insulation breakdown voltage: more than 5000V, high voltage resistance，safety
◆ Flame-retardant Level：UL94V－0，Optimal flame retardant level
◆ Temperature range：-60℃~200℃，wide range of applications environment
◆ Size：200MM*300MM*0.5MM－6MM
◆ Product size and thickness can be customized according to customer requirements
Product application：
◆ Automotive electronics
◆ Industrial controller
◆ Power supply
◆Television and consumer electronics